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电子元件”相关标准“电子元件”相关标准1GB/T1772-1979电子元器件失效率试验方法Determination offailure rateof electronicelements andcomponents2GB/T2036-1994印制电路术语Terms for printed circuits3GB/T2413-1980压电陶瓷材料体积密度测量方法Piezoelectric ceramicmaterials-Measuring methodsfor determinationof volumedensity4GB/T2470-1995电子设备用固定电阻器、固定电容器型号命名方法Type designationsystem for fixed resistors and fixedcapacitors for use in electronic equipment5GB/T2471-1995电阻器和电容器优先数系Preferred numberseries forresistorsandcapacitors6GB/T2472-1981电子设备用固定式电容器工作电压系列Fixed capacitors for electronic equipments-Working voltageseries7GB/T2473-1981电子设备用矩形金属外壳电容器外形尺寸系列Capacitors withrectangular metalenclosure for electronic equipments—Outline dimensionsseries8GB/T2474-1981电子设备用圆形金属外壳电容器外形尺寸系列Capacitors withdisc metalenclosure forelectronic equipments—Outline dimensionsseries9GB/T2658-1995小型交流风通用机技术条件A.C.miniature blowers,general specificationfor10GB/T2693-1990电子设备用固定电容器第一部分总规范(可供认证用)Fixed capacitors for use in electronic equipment-Part1:Generic specification11GB/T2775-1993手控电子元件的轴端尺寸Dimensions ofspendle endsfor manuallyoperated electroniccomponents12GB/T3351-1982人造石英晶体的型号命名Designations forsynthetic quartzcrystals13GB/T3388-1982压电陶瓷材料型号命名方法Designations fortypes ofpiezoelectric ceramics14GB/T
3389.3-1982压电陶瓷材料性能测试方法居里温度Tc的测试Test methodsfor theproperties ofpiezoelectric ceramics—Test forCurie temperatureTc15GB/T
3389.4-1982压电陶瓷材料性能测试方法柱体纵向长度伸缩振动模式Test methodsfor theproperties ofpiezoelectric ceramics-Longitudinal lengthextension vibrationmode forrod16GB/T
3389.7-1986压电陶瓷材料性能测试方法强场介电性能的测试Test methodsfor theproperties ofpiezoelectric ceramics-Test for dielectric propertiesin highelectric field17GB/T
3389.8-1986压电陶瓷材料性能测试方法热释电系数的测试Test methodsfor theproperties ofpiezoelectric ceramics—Test for the pyroelectriccoefficient18GB/T3664-1986电容器非线性测量方法Method ofmeasurement ofnon-linearity incapacitors19GB/T3788-1995真空电容器通用技术条件General specificationfor vacuumcapacitors20GB/T4071-1983光致荧光粉测试方法Measuring method forthephosphor excitedby light21GB/T4072-1983阴极射线致荧光粉测试方法Measuring method of thephosphor excitedby cathoderays22GB/T
4098.1-1983射频电缆电晕试验方法Test methodof coronafor radio-frequency cables23GB/T
4098.2-1983射频电缆电容和电容不平衡测量方法Methods ofmeasurement of capacitance andcapacitance unbalancefor radio-frequency cables24GB/T
4098.3-1983射频电缆特性阻抗测量方法Methods ofmeasurement ofcharacteristic impedancefor radio-frequency cables25GB/T
4098.4-1983射频电缆衰减常数测量方法Methods ofmeasurement of attenuation constantfor radio-frequency cables26GB/T
4098.5-1983射频电缆电容稳定性试验方法Test methodofcapacitancestability for radio-frequency cables27GB/T
4098.6-1983射频电缆衰减稳定性试验方法Test methodof attenuationstability forradio-frequency cables28GB/T
4098.7-1983射频电缆高温试验方法Test methodof high-temperature forradio-frequency cables29GB/T
4098.8-1983射频电缆低温试验方法Test methodof low-temperature forradio-frequency cables30GB/T
4098.9-1983射频电缆流动性试验方法Test methodof flowforradio-frequency cables31GB/T
4098.10-1983射频电缆尺寸稳定性试验方法Test methodof dimensionalstability forradio-frequency cables32GB/T4165-1984电子设备用可变电容器的使用导则Guide tothe use of variable capacitors in electronic equipment33GB/T4166-1984电子设备用可变电容器的试验方法Methods oftest ofvariablecapacitorsin electronicequipment34GB/T4210-1984电子设备用机电元件名词术语Terms ofelectromechanical componentsforelectronicequipment35GB/T4475-1995敏感元器件术语Terms ofsensor36GB/T
4588.1-1996无金属化孔单双面印制板分规范Sectional specification:single anddouble sided printed boards with plainholes37GB/T
4588.2-1996有金属化孔单双面印制板分规范Sectional specification:single anddouble sidedprinted boardswith plated-through holes38GB/T
4588.3-1988E[]制电路板设计和使用Design anduseof printed boards39GB/T
4588.4-1996多层印制板分规范Sectional specification—Multilayer printed boards40GB/T
4588.10-1995印制板第10部分有贯穿连接的刚挠双面印制板规范Printed boards-Part10:Specification forflex-rigid double-sidedprinted boardswiththrough connections41GB/T4596-1984电子设备用三相变压器形铁心E-cores forthree-phase transformersfor use in electronicequipment42GB/T
4677.1-1984印制板表层绝缘电阻测试方法Test methodof surfaceinsulation resistance for printed boards43GB/T
4677.2-1984印制板金属化孔镀层厚度测试方法微电阻法Micro-resistance test methodof plating thicknessof platedthrough holes for printed boards44GB/T
4677.3-1984印制板拉脱强度测试方法Test methodsof pullstrength for printed boards45GB/T
4677.4-1984印制板抗剥强度测试方法Test methodsof peelstrength for printed boards46GB/T
4677.5-1984印制板翘曲度测试方法Test methodsof platnessfor printed boards47GB/T
4677.6-1984金属和氧化覆盖层厚度测试方法截面金相法Test methodsfor thicknessof metaland oxidecoating bymicroscopical examinationof cross-section48GB/T
4677.7-1984印制板镀层附着力试验方法胶带法Test methodof platingadhesion byadhesive typeforprinted boards49GB/T
4677.8-1984印制板镀涂覆层厚度测试方法B反向散射法Test methodof platingand coatingthickness bybeta backscatteringforprinted boards50GB/T
4677.9-1984印制板镀层孔隙率电图象测试方法The electrographictestmethodofplatingporosity forprinted boards51GB/T
4677.10-1984印制板可焊性测试方法Test methodof solderabilityforprinted boards52GB/T
4677.11-1984印制板耐热冲击试验方法Test methodsof thermalshock forprinted boards53GB/T
4677.12-1988印制板互连电阻测试方法Test methodof interconnectionresistanceforprinted boards54GB/T
4677.13-1988印制板金属化孔电阻的变化热循环测试方法Test methodof changein resistance of plated-throughholes-Thermal cyclingforprintedboards55GB/T
4677.14-1988印制板蒸汽-氧气加速老化试验方法Test methodof steam/oxygen acceleratedageing of printedboard56GB/T
4677.15-1988印制板绝缘涂层耐溶剂和耐焊剂试验方法Test methodfor solventand fluxresistanceofinsulating coatingon printedboards57GB/T
4677.16-1988E|1制板一般检验方法General examinationmethodforprintedboards58GB/T
4677.17-1988多层印制板内层绝缘电阻测试方法Test methodfor insulationresistance withininner layers of multilayer printedboards59GB/T
4677.18-1988多层印制板层间绝缘电阻测试方法Test methodfor insulationresistance betweenlayersofmultilayerprintedboards60GB/T
4677.19-1988印制板电路完善性测试方法Test methodfor electricalintegrity ofprintedboards61GB/T
4677.20-1988印制板镀层附着性试验方法摩擦法Test methodfor platingadhesion ofprintedboards—Burnishing62GB/T
4677.21-1988印制板镀层孔隙率测试方法气体暴露法Test methodfor platingporosity ofprintedboards-The gasexposure method63GB/T
4677.22-1988印制板表面离子污染测试方法Test methodfor surfaceionic contaminationofprintedboards64GB/T
4677.23-1988印制板阻燃性能测试方法Test methodfor flammabilityofprintedboards65GB/T4721-1992印制电路用覆铜箔层压板通用规则General rulesfor copper-clad laminatedsheets forprinted circuits66GB/T4722-1992E[1制电路用覆铜箔层压板试验方法Test methodsfor copper-clad laminatedsheets forprinted circuits67GB/T4723-1992印制电路用覆铜箔酚醛纸层压板Phenolic cellulosepaper copper-clad laminatedsheets forprinted circuits68GB/T4724-1992印制电路用覆铜箔环氧纸层压板Epoxide cellulosepaper copper-clad laminatedsheets forprinted circuits69GB/T4725-1992印制电路用覆铜箔环氧玻璃布层压板Epoxide wovenglass fabriccopper-clad laminatedsheets forprinted circuits70GB/T
4779.1-1984彩色显象管用荧光粉Y22-G3荧光粉Phosphors forcolor picturetubes use—Phosphor Y22-G371GB/T
4779.2-1984彩色显象管用荧光粉Y22-B2荧光粉Phosphors forcolor picturetubes use—Phosphor Y22-B272GB/T
4779.3-1984彩色显象管用荧光粉Y22-R4荧光粉Phosphors forcolor picturetubes use—Phosphor Y22-R473GB/T
4825.1-1984印制板导线局部放电测试方法Test methodfor partialdischarge of conductors on printedboards74GB/T
4825.2-1984印制板导线载流量测试方法Test methodfor currentcarrying capacityofconductorsonprintedboards75GB/T4874-1985直流固定金属化纸介电容器总规范Generic specificationforfixedmetallized paperdielectric capacitorsfor directcurrent76GB/T5076-1985具有两个轴向引出端的圆柱体元件的尺寸测量Measurement of the dimensionsofacylindrical componenthaving twoaxial terminations77GB/T5077-1985电容器和电阻器的最大外形尺寸Maximum casedimensions forcapacitors and resistors78GB/T5078-1985单向引出的电容器和电阻器所需空间的测定方法Method forthe determinationofthespace requiredby capacitorsandresistorswith unidirectionalterminations79GB/T5489-1985印制板制图Printed boarddrawing80GB/T
5594.1-1985电子元器件结构陶瓷材料性能测试方法气密性测试方法Test methodsfor propertiesof structureceramic usedin electroniccomponents-Test methodfor gas-tightness81GB/T
5594.2-1985电子元器件结构陶瓷材料性能测试方法杨氏弹性模量、泊松比测试方法Test methodsfor propertiesof structureceramic usedin electroniccomponents-Test methodfor Youngselastic modulusand Poissonratio82GB/T
5594.3-1985电子元器件结构陶瓷材料性能测试方法平均线膨胀系数测试方法Test methodsfor propertiesof structureceramic usedin electroniccomponents—Test methodfor meancoefficient oflinear expansion83GB/T
5594.4-1985电子元器件结构陶瓷材料性能测试方法介质损耗角正切值的测试方法Test methodsfor propertiesof structureceramic usedin electroniccomponents—Test methodfordielectricloss angletangent value84GB/T
5594.5-1985电子元器件结构陶瓷材料性能测试方法体积电阻率测试方法Test methodsfor propertiesof structureceramic usedin electroniccomponents-Test methodfor volumeresistivity85GB/T
5594.6-1985电子元器件结构陶瓷材料性能测试方法化学稳定性测试方法Test methodsfor propertiesof structureceramic usedin electroniccomponents—Test methodfor chemicaldurability86GB/T
5594.7-1985电子元器件结构陶瓷材料性能测试方法透液性测定方法Test methodsfor propertiesof structureceramic usedin electroniccomponents—Test methodfor liquidpermeability87GB/T
5594.8-1985电子元器件结构陶瓷材料性能测试方法显微结构的测定Test methodsfor propertiesof structureceramic usedin electroniccomponents—Determination ofmicrostructure88GB/T5598-1985氧化镀瓷导热系数测定方法Test methodfor thermalconductivity ofberyllium oxideceramics89GB/T5729-1994电子设备用固定电阻器第一部分总规范Fixed resistorsfor usein electronicequipment—Part1:Generic specification90GB/T5730-1985电子设备用固定电阻器第二部分分规范低功率非线绕固定电阻器(可供认证用)Fixed resistorsfor usein electronicequipment—Part2:Sectional specification:Fixed low-power non-wire woundresistors91GB/T5731-1985电子设备用固定电阻器第二部分空白详细规范低功率非线绕固定电阻器评定水平E(可供认证用)Fixed resistorsfor usein electronicequipment-Part2:Blank detailspecification:Fixed low-power non-wire woundresistors-Assessment level E92GB/T5732-1985电子设备用固定电阻器第四部分分规范功率型固定电阻器(可供认证用)Fixed resistorsfor usein electronicequipment—Part4:Sectional specification:Fixed powerresistors93GB/T5733-1985电子设备用固定电阻器第四部分空白详细规范功率型固定电阻器评定水平E(可供认证用)Fixed resistorsfor usein electronicequipment—Part4:Blank detailspecification:Fixed powerresistors Assessment levelE94GB/T5734-1985电子设备用固定电阻器第五部分分规范精密固定电阻器(可供认证用)Fixed resistorsfor usein electronicequipment—Part5:Sectional specification:Fixed precisionresistors95GB/T5735-1985电子设备用固定电阻器第五部分空白详细规范精密固定电阻器评定水平E(可供认证用)Fixed resistorsfor usein electronicequipment-Part5:Blank detailspecification:Fixed precisionresistors—Assessment levelE96GB/T5838-1986荧光粉名词术语Terms forphosphors97GB/T5966-1996电子设备用固定电容器第8部分分规范1类瓷介固定电容器Fixed capacitorsfor useinelectronicequipment-Part8:Sectional specification:Fixed capacitors of ceramic dielectric,class198GB/T5967-1996电子设备用固定电容器第8部分空白详细规范1类瓷介固定电容器评定水平E Fixed capacitorsforuseinelectronicequipment-Part8:Blank detailspecification Fixed capacitorsof ceramic dielectric,class1—Assessment levelE99GB/T5968-1996电子设备用固定电容器第9部分分规范2类瓷介固定电容器Fixedcapacitorsforuseinelectronicequipment—Part9:Sectional specification Fixedcapacitorsofceramicdielectric,class2100GB/T5969-1996电子设备用固定电容器第9部分空白详细规范2类瓷介电容器评定水平E Fixedcapacitorsforuseinelectronicequipment-Part9:Blank detailspecificationFixedcapacitor ofceramicdielectric,class2—AssessmentlevelE。